Capability
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Component Capabilities
Solder Paste PrintingSMT (BGA, uBGA, PoP and 01005, 008004)BGA/CSP/CBGA/CCGA/PGA Down To 270 Micron PitchSoldering & Flip Chip with Die Size of 0.5~50mmCOB/FOG/PoPMulti-Chip, Chip On FPC
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Manufacturing Capabilities
Electronic AssemblyComplete Device AssemblySystem Build/System Integration/ProgrammingProcess Design & OptimizationConformal Coating (UV-Curable)Chip Underfill/Corner BondingMaterial HandlingComponent TraceabilityTest & ValidationFEMA System (PFMEA)PCBA AssemblyBox-BuildIPXX AssemblyDie Bonding / Wire BondingSelective Wave SolderingUltrasonic Welding / Laser EngravingDFM/DFA
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Testing Capabilities
Circuit/Functional TestBoundary ScanFlying Probe2D/3D AOI, AXI2D/3D X-RayATE, DFT, RF, HASSBurn InESD CheckHi-Pot Test
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Service Capabilities
JDM (Join Design Manufacturing)Prototype/NPI/MPLow Volume/High MixLogisticTurnkey/SourcingRMAHigh Volume / Low MixCustomized ServicesSoftware / Hardware DesignInstitutional DesignFlexible Material Preparation StrategiesVerification And Confirmation
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Equipment Capabilities
PRODUCTION EQUIPMENT
Mounting Machine、、High Speed Machine、、Multi-Function Mounter、、Die/Wire Bonding、、Underfill/Glop Top Machine、、Reflow Machine、、Soldering Machine、、Routing Machine、、Ultrasonic Machine、、Press Fit Machine
TEST EQUIPMENT
PCB Appearance Check Machine、、Solder Paste Thickness Tester、、3D SPI/AOI/ICT/X-Ray、、FAI Tester、、Flying Probe、、Boundary Scan、、RELIABILITY EQUIPMENT、、Burn In RoomRELIABILITY EQUIPMENT
Burn In Room、、Salt Spray Tester、、Integrating Sphere、、Temperature & Humidity Chamber、、Vibration Tester、、Thermal Shock、、Drop Tester、、ESD Simulator
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